Benjamin Webb

Hybrid Principal Layout Designer, Medtronic, Inc., Micoelectronics Center

Hybrid Principal Layout Designer: I am also a Printed Circuit Board Designer or PCB Designer. 5 years in Low frequency Hybrid Design with RF. I have been in this or related fields for 26 Years in Electrical/Mechanical Design. I have designed Signal, double and multi-layer printed circuit boards. At the component level I have designed Ball Grid Array or BGA; SCSP; SBGA; EBGA; TSBGA; ULTRA BGA; HPBGA; SiP; MCMBGA; TEPBGA; PBGA; CABGA; and integrated circuit chips in ball grid array packages for 11 years using Cadence, Zuken, IC Packager, and AutoCAD. I do Gerber checking using CAM350. Make a complete design documentation package using AutoCAD and Pro Engineer or Pro-E. Other tools include but not limited to are Microsoft tools, and Internet on a daily bases. I interact with customers, engineering, and factories worldwide. Self motivated, self-starter, with little or no supervision.