Fred Kinder

President, USEA

President (owner), U.S. Export Authority Inc. 1989-Present. Provide contract manufacturing assembly and test services for the Semiconductor industry. Developed unique test process for final test of CSP/bumped semiconductor chips that improve final test quality assurance and reliability. Developed unique test instrumentation for testing UIL, RG and QG for MOSFET semiconductor devices in a single insertion. This allows for improved cost and quality of test. Received Vendor of the year award in 2000 from Philips (NXP). President (owner), Encore Technology Inc., 1984- Present. Semiconductor Assembly consulting and equipment sales. President (owner), Piezo Source Inc., 2005-Present, Purchased the Piezo Speaker Product Line originally developed and managed by Motorola, Inc. V.P. Sales Indy Electronics, Manteca, CA 1981-1983. Responsible for sales of the largest domestic semiconductor assembly operation. Indy received Vendor of the Year Award from Texas Instruments Inc., (TI) in 1983. Manager of Marketing, Technology Glass Inc., Sunnyvale, CA 1977-1981 Responsible for sales and marketing of specialty semiconductor packaging materials. Received Vendor of the Year Award from TI in 1979 and 1980. Field Sales Specialist Plessey Materials Div., Melville, NY Western U.S. 1976-1977 (Mt View sales office), Mid West (Chicago Sales office) 1973-1976, provided sales and applications support for semiconductor and thick film precious metal packaging materials. QA Engineer – Quaker Oats/Louis Marx Toys, Glen Dale, WV started the quality assurance and control dept. 1971-1973. Developed policies and procedures. Process Engineering Supervisor, Erie Technology Products, Erie PA 1967-1970. Responsibility included process control, yield improvement, new materials and new product process qualification for the thick film hybrid product line.